GVC嵌入驱动半导体产业供应链韧性的演进路径:基于华润微电子的纵向案例研究
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F274

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国家社会科学基金重大专项(23VHQ020)。


Evolutionary path of supply chain resilience in the semiconductor industry driven by GVC embeddedness: A longitudinal case study of china resources microelectronics
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    摘要:

    在逆全球化、技术封锁与供应链安全约束加剧的背景下,半导体产业面临严峻的断链风险,提升供应链韧性已成为关乎国家经济安全的重要议题。基于华润微电子40余年发展历程的单案例纵向研究,结合扎根理论方法,系统剖析后发半导体企业通过GVC嵌入动态调整驱动供应链韧性演化的内在逻辑。研究表明:(1)供应链韧性的构建是一个由“被动适应”向“主动编排”进阶的动态演化过程,依次表现为风险抵御力、协同创新力和生态重构力,具体实现由基础生存与恢复韧性、缓冲与适应韧性向系统防御与转型韧性的阶段性跃迁;(2)识别出驱动供应链韧性演化的三种关键机制,即技术冗余机制化解短期风险、网络协同机制促进能力跃迁、生态重构机制保障长期韧性自主,三者分别对应企业发展的不同阶段;(3)动态能力是连接微观企业行为与宏观供应链韧性的核心传导变量,阶段性情境约束推动企业形成感知判断与资源拼凑、机会探索与资源整合、机会开发与资源重构等差异化能力,最终在宏观层面涌现出系统韧性。本文将GVC研究视角由“经济升级”拓展至“安全韧性构建”,为破解高科技产业“卡脖子”困境提供了“技术冗余构建—IDM模式转型—生态网络编排”的系统性可行方向。

    Abstract:

    In the context of de-globalization, technology blockades, and increasing supply chain security pressures, the semiconductor industry faces serious risks of supply chain disruption.Enhancing supply chain resilience has become a critical issue for national economic security. Based on a single-case longitudinal study of China Resources Microelectronics’ over forty years of development, and combined with grounded theory methods, this paper systematically analyzes the internal logic by which latecomer semiconductor enterprises drive the evolution of supply chain resilience through dynamic adjustments embedded in the Global Value Chain (GVC). The study shows that: (1) the construction of supply chain resilience is a dynamic evolutionary process progressing from “passive adaptation” to “active orchestration,”specifically manifesting as risk resistance, collaborative innovation, and ecosystem reconstruction. The realization path progresses from basic survival and recovery resilience, buffer and adaptive resilience, gradually advancing to system defense and transformation resilience; (2) three key mechanisms driving the evolution of supply chain resilience have been identified: the technological redundancy mechanism mitigates short-term risks, the network collaboration mechanism promotes capability leaps, and the ecosystem reconfiguration mechanism ensures long-term resilience autonomy, corresponding to different stages of enterprise development; (3) dynamic capabilities are the core transmission variable connecting micro-level enterprise behavior and macro-level supply chain resilience.Contextual constraints at different stages drive firms to form different capabilities, such as perception and judgment with resource bricolage, opportunity exploration with resource integration, and opportunity development with resource reconstruction, ultimately resulting in systemic resilience at the macro level. This paper expands the GVC research perspective from “economic upgrading” to “security resilience building,” offering a systematic action guide of “building technological redundancy—transforming the IDM model—orchestrating the ecological network” to address the bottleneck challenges in high-tech industries.

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郭庆宾,刘敬,陈嘉仪. GVC嵌入驱动半导体产业供应链韧性的演进路径:基于华润微电子的纵向案例研究[J].中国软科学,2026,(8):157-171

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  • 在线发布日期: 2026-09-16
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